In this journal article, Erick Yee, a renowned electromechanical engineer technologist offers an incisive and descriptive explanation on how the Molded Interconnect Devices (MIDs) have revolutionized the electromechanical design. He provides a broad explanation on how the traditional mechanical and electrical designs have been upgraded to better levels to allow applications in telecommunication and automotive industries.
In the paper, the technologist uses varied examples of special areas and application procedures that the MIDs have occupied in the current society. In the paper Erick provides some of the vivid description on how the machine operates in order to achieve the required design. The article provides a preference of the appliance to replace the components of the former circuit board. According to Erick, the appliance is preferred due to its ability to integrate both the electrical and mechanical option. In turn, he believes that the integration allows the entire design to effectively and efficiently manufacture and assemble the entire function system. In his elaborate and descriptive paper, the technologist elaborates on how the design uses the 3D application unlike the PC boards that uses only the 2D applications. The author provides the various areas where the design may be applied including the automotive application in the antennae as stub or retractor, thus enabling efficiency. Nevertheless, the technologist is quite remorseful on the people’s ignorance on the availability of the application.
In conclusion, the journal articles is one of the most important articles to be used in the field of Electromechanical Engineering Technology as it provides enormous description and principles of electromechanical design. Erick provides the engineers with critical component of application in both mechanical and automotive designs.
Works Cited
Yee, Eric. "Molded Interconnect Devices Reshape Electromechanical Design." Electronic Design 48.18 (2000): 141
